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| Chipboard | Low-density
Chipboard in various thicknesses (.020" - .060"/0.5 mm - 1.52 mm) |
Cushion-effect
for crimp mark protection. |
| Chipboard | Low-density & low-porosity Chipboard | Cushion-effect for crimp mark protection. For use on robotic lines. |
| Coated Chipboard | Chipboard and moisture barrier coating | Cushion-effect for crimp mark protection. Moisture barrier and heat-sealable to outside header. |
| Laminated Chipboard | Multi-ply
Chipboard lamination up to .135"/3.4 mm |
Crimp mark protection and low-porosity for high-vacuum robotic lines. |
| Corlam® | Chipboard,
corrugated and Linerboard laminate in various thicknesses, multi-wall. (.170" - .175"/ 4.3 mm - 4.44 mm) |
Top-of-the line cushion inside header. Flat crush resistance for better crimp mark protection. Ultimate debris protection. Moisture-barrier. For use on robotic lines. |
| Microlam™ | Chipboard, corrugated and Linerboard laminate (.080"/2 mm) | Cushion-effect for better crimp mark protection. Debris protection. For use on robotic lines. |
| Corrugated | Various flute options and thicknesses, multi-wall | Crimp mark protection. |
| Specialty Products |
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